Note: The job is a remote job and is open to candidates in USA. NVIDIA is a leader in GPUs and SOCs, continually innovating to deliver solutions across various sectors. They are seeking a Senior Package Layout Engineer to collaborate with design teams on the layout of IC substrates and optimize package designs for performance and efficiency.
Responsibilities
- As part of a Layout team, you will collaborate to implement high speed/density ASIC packages
- Perform substrate breakout patterns for ASIC packages
- Optimize package pinout incorporating system level trade-offs of pins assignment
- Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite
- Propose layout design trade-offs to the Technical Package Lead for resolution and implementation
- Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance
- Develop symbols and CAD library databases using Cadence APD design tools
- Develop methodologies to improve layout productivity
Skills
- Hold a B.S. Electrical Engineering or equivalent experience
- 5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology. Experience with HDI designs is a plus
- Proven experience in substrate layout of wire bond and flip chip packages, preferred
- Significant background with Cadence APD or SiP and/or PCB layout tools (including Constraint Manager)
- Solid understanding of high-speed design signal integrity practices
- Experience with Virtuoso and Calibre is a plus
- Experience using Valor is helpful
Benefits
- You will also be eligible for equity and [benefits](https://www.nvidia.com/en-us/benefits/).
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