Note: The job is a remote job and is open to candidates in USA. Firefly Aerospace is a space and defense technology company on a mission to reliably and repeatedly launch, land, and operate space systems from Earth to the Moon and beyond. As the lead Mechanical Engineer for Avionics, you will develop electronics enclosures and mechanical components while mentoring junior engineers and collaborating with multidisciplinary teams to ensure mission success.
Responsibilities
- Lead design and architecture of ruggedized electronics packaging and structural components for PCB assemblies used in launch vehicle and spacecraft applications
- Design and optimize complex electro-mechanical assemblies for extreme thermal and dynamic environments, EMI/EMC compatibility, and radiation resistance
- Perform and review advanced thermal analyses (steady-state, transient, and thermal cycling) of electronics in space environments
- Perform and review modal, random vibration, and shock analyses of electronic assemblies to ensure structural integrity during launch
- Oversee the design of high-reliability test fixturing and ground support equipment (GSE) for launch vehicle and spacecraft electronics
- Define, execute, and lead vibration, shock, and thermal vacuum (TVAC) environmental test campaigns for product qualification and acceptance
- Drive the creation of CAD models, engineering drawings, and technical documentation; lead formal design reviews (PDR, CDR) and present to leadership
- Partner closely with the PCB design team to establish mounting strategies, keep-outs, tolerance stack-ups, connector placement, and advanced thermal management solutions
- Mentor and guide junior and mid-level engineers, establishing design best practices and reviewing their technical work
Skills
- Bachelor of Science in Mechanical Engineering, Aerospace Engineering, or a related technical field
- 5+ years of professional industry experience designing high-reliability electronics packaging and electro-mechanical assemblies (preferably in aerospace, defense, or automotive)
- Demonstrated expertise in 3D CAD design (NX preferred) and geometric dimensioning and tolerancing
- Proven track record of taking complex electro-mechanical products from initial concept through environmental qualification and production
- Proficiency with NX CAD and finite element analysis (FEA) tools such as ANSYS
- Experience with multi-layer PCBA enclosure design, including complex thermal interface materials (TIMs) and CTE analysis
- Strong understanding of structural and thermal calculations, including vent analyses, EMI/EMC shielding, worst-case tolerance stack-ups, bolt pre-loads, and Steinberg PCB solder joint fatigue life predictions
- Systems-level understanding of launch vehicle architectures, instrumentation interfaces, and avionics master networks
- Expert knowledge of manufacturing methodologies (5-axis CNC machining, sheet metal, additive manufacturing) and material/plating selection for spaceflight environments
- Experience interfacing with external vendors and manufacturing partners to resolve DFM issues and expedite production
Company Overview
Company H1B Sponsorship